Ebook Advanced Materials for Thermal Management of Electronic Packaging 30 (Springer Series in Advanced Microelectronics)
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Book Details :
Published on: 2011-01-05
Released on: 2011-01-05
Original language:
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging. Integrating MEMS and ICs : Microsystems & Nanoengineering Microsystems & Nanoengineering is an international open access journal publishing original articles and reviews covering all aspects of microsystems and ... LAMMPS Publications This page lists papers that LAMMPS Publications This page lists papers that cite LAMMPS via the original 1995 J Comp Phys paper discussed here which includes a discussion of the basic parallel ... Integrated circuit - Wikipedia An integrated circuit or monolithic integrated circuit (also referred to as an IC a chip or a microchip) is a set of electronic circuits on one small flat piece (or ... Nanocomposites: synthesis structure properties and new ... REVIEW ARTICLE . Nanocomposites: synthesis structure properties and new application opportunities . Pedro Henrique Cury Camargo; Kestur Gundappa Satyanarayana * ... How to perform Critical Path Method (CPM) and find Float ... offpeaktraining.com - This video provides an overview of how to perform Critical Path Method (CPM) to find the Critical Path and Float using a ... International Journal of Engineering Research and Applications International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research .. Online Exhibitor Planner - iebms.pittcon.org Our company is a provider of advanced sensor and chemical detection solutions based on mass spectrometry. The 1st Detect miniature mass spectrometer represents a ... Job Interview Online Practice Test Question - hr-secrets.com Job Interview Practice Test Why Do You Want This Job? Answer this job interview question to determine if you are prepared for a successful job interview International Journal of Engineering Research and ... International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research .. Nanoimprint Lithography InTechOpen Nanoimprint Lithography. By Hongbo Lan and Yucheng Ding DOI: 10.5772/8189
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